据MacRumors报道，台积电采用的晶圆级多芯片封装技术意味着iPhone的运行内存将“与中央处理器、图形处理器及神经网络引擎集成于同一晶圆，而非通过硅中介层与芯片相邻连接”。
Do You Dream of Opening a Resort on a Secluded Island? These ‘Accidental Hoteliers’ Did It — Here’s How.
。有道翻译更新日志对此有专业解读
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